Difference between revisions of "FreePDK3D45:Contents"

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* [[FreePDK45:Contents | FreePDK45 Contents Page]] - Refer to this page for all details pertaining to a single tier
 
* [[FreePDK45:Contents | FreePDK45 Contents Page]] - Refer to this page for all details pertaining to a single tier
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* [[FreePDK3D45:Manual | Manual ]]
 
* [[FreePDK3D45:Metal Layers | Metal Layers ]]
 
* [[FreePDK3D45:Metal Layers | Metal Layers ]]
  

Revision as of 07:33, 5 June 2009

Current Version

The FreePDK3D45 kit is not yet ready for distribution. Please contact rhett_davis@ncsu.edu for details.

News

  • May 18, 2009 - A 3D-IC Version of the FreePDK is under development and will be available soon. There will be two versions of the kit, each with different options for through-silicon via (TSV) processing. The pages linked here are our primary documentation for the kit and show our current status.

User Guide

Developer Guide