Difference between revisions of "FreePDK3D45:Contents"

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This page collects all resources relevant to the FreePDK3D45<sup>TM</sup> 3D-IC variant of the FreePDK<sup>TM</sup> process design kit.
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== Current Version ==
 
== Current Version ==
The FreePDK3D45 kit is not yet ready for distributionPlease contact rhett_davis@ncsu.edu for details.
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The latest FreePDK3D45 distribution is version 1.1You can download it [http://www.eda.ncsu.edu/eda_registration.php here].  You can sign up to receive email alerts of design kit updates on our extremely-low-traffic [[ncsu-eda-announcements|announcements mailing list]].
  
 
== News ==
 
== News ==
* '''May 18, 2009''' - A 3D-IC Version of the FreePDK is under development and will be available soonThere will be two versions of the kit, each with different options for through-silicon via (TSV) processing.  The pages linked here are our primary documentation for the kit and show our current status.
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* '''July 28, 2011''' - Version 1.1 of the FreePDK3D45 has been released, featuring a 5-tier technology, new design rules, and instructions for compiling variants of this kit.  Many of the improvements from the FreePDK45 1.4 have also been included.  See the release notes below for more details.
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* '''June 5, 2009''' - Version 1.0 of the FreePDK3D45 has been released.  This kit is a 3D-IC Version of the FreePDK.  The current kit is for a two-tier, face-to-face, bulk process, however the kit is capable of producing a three-tier version with some modification.  Please contact us for more details on generating variants of this kit.  The pages linked here are our primary documentation for the kit and show our current status.
  
 
== User Guide ==
 
== User Guide ==
  
 
* [[FreePDK45:Contents | FreePDK45 Contents Page]] - Refer to this page for all details pertaining to a single tier
 
* [[FreePDK45:Contents | FreePDK45 Contents Page]] - Refer to this page for all details pertaining to a single tier
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* [[FreePDK3D45:Manual | Manual ]]
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* [[FreePDK3D45:Release_Notes | Release Notes ]]
 
* [[FreePDK3D45:Metal Layers | Metal Layers ]]
 
* [[FreePDK3D45:Metal Layers | Metal Layers ]]
  
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* [[FreePDK3D45:RuleDevel | Design Rules Development ]]
 
* [[FreePDK3D45:RuleDevel | Design Rules Development ]]
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== Related Links ==
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* [[Pathfinder3D:Contents | Pathfinder3D Contents Page ]]

Latest revision as of 10:19, 10 November 2011

This page collects all resources relevant to the FreePDK3D45TM 3D-IC variant of the FreePDKTM process design kit.

Current Version

The latest FreePDK3D45 distribution is version 1.1. You can download it here. You can sign up to receive email alerts of design kit updates on our extremely-low-traffic announcements mailing list.

News

  • July 28, 2011 - Version 1.1 of the FreePDK3D45 has been released, featuring a 5-tier technology, new design rules, and instructions for compiling variants of this kit. Many of the improvements from the FreePDK45 1.4 have also been included. See the release notes below for more details.
  • June 5, 2009 - Version 1.0 of the FreePDK3D45 has been released. This kit is a 3D-IC Version of the FreePDK. The current kit is for a two-tier, face-to-face, bulk process, however the kit is capable of producing a three-tier version with some modification. Please contact us for more details on generating variants of this kit. The pages linked here are our primary documentation for the kit and show our current status.

User Guide

Developer Guide

Related Links